Domestic optical modules are more mature in industrialization, mass production, and customer acceptance than photonic chips. Key players: Zhongji Innolight, Accelink Technologies, and Xinyiseng demonstrate strong production capacity and supply chain stability at the module level. “Localization of optical module chips” refers to China's capability to independently develop and manufacture the core chips and key components used in high-speed optical communication modules, including electrical chips (DSP / Driver / TIA), optical device chips (laser / photodetector), and silicon. Spurred by the AI computing boom and large-scale 5G deployment, optical modules, the critical backbone of communication infrastructure, are undergoing a significant shift towards domestic production in China. By employing techniques like molecular covalent bonding and adhesive bonding, III-V materials are integrated with silicon photonic devices to fabricate. In 2026, the large-scale expansion of AI computing power clusters continues, and the industry's supply-demand contradiction gradually shifts upward, transmitting from the traditional optical module assembly capacity to the core upstream optical chip segment.
