Its silicon photonics engine product, developed based on the proprietary XDFOI® multi‑dimensional heterogeneous integration advanced packaging platform, has successfully completed customer sample delivery and passed testing, achieving technical validation and taking a crucial step. Its silicon photonics engine product, developed based on the proprietary XDFOI® multi‑dimensional heterogeneous integration advanced packaging platform, has successfully completed customer sample delivery and passed testing, achieving technical validation and taking a crucial step. On January 21, JCET announced a major breakthrough in its co-packaged optics (Co-Packaged Optics, CPO) technology development. The company has delivered customer samples of its silicon photonics engine developed on the XDFOI ® advanced packaging platform. The samples have successfully completed customer validation. On January 21, global leading integrated circuit packaging and test service provider JCET announced a key breakthrough in Co‑Packaged Optics (CPO) technology. This approach helps. Co-packaged optics (CPO)—the silicon photonics technology promising to transform modern data centers and high-performance networks by addressing critical challenges like bandwidth density, energy efficiency, and scalability—is finally entering the commercial arena in 2025. According to a report. HSINCHU, Taiwan, December 8, 2025 — United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of.
