In collaboration with NVIDIA, Infineon will develop the next generation of power systems based on a new architecture with centralized power generation through 800V high-voltage direct current (HVDC). The IEA's latest report, Key Questions on Energy and AI (April 2026), puts the updated trajectory plainly: consumption will roughly double and reach almost 500 TWh in 2025 to 950 TWh by 2030, with AI-specific infrastructure tripling over the same period. We'll discuss state-of-the-art topologies and concepts, leveraging Silicon, Gallium Nitride (GaN), and Silicon Carbide (SiC) to achieve higher. This blog post explores innovations in power devices, gate drivers and advanced controllers with Digital Signal Processing (DSP) capabilities to meet Artifical Intelligence (AI) servers' power and efficiency needs. The rise of artificial intelligence (AI) has significantly increased computing. The rapid scaling of artificial intelligence (AI) servers and hyperscale data centers is driving new requirements for high efficiency, high density power supply unit (PSU) architectures. AI workloads demand precise power delivery, fast transient response, and robust isolation to support GPUs. Texas Instruments (TI) today debuted new design resources and power-management chips to help companies meet growing artificial intelligence (AI) computing demands and scale power-management architectures from 12V to 48V to 800 VDC.
